Thin film capacitors for core and adjacent build up layers
US11388821B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Sep 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device substrate includes a core material. A capacitor sheet can be affixed adjacent to a surface of the core material, where the capacitor sheet covers the surface of the core material. A first opening can extend through both capacitor sheet and the core material, where the first opening are larger than a substrate pass through-hole. An electrically inert material can fill the first opening. A second opening can extend parallel to the first opening through the electrically inert material, where the second opening is at least as large as the substrate pass through-hole and having sidewalls enclosed within the electrically inert material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.