Methods for improved polymer-copper adhesion
US11388822B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
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Key dates
| Filing date | Aug 28, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Oct 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0759
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for forming circuit boards and circuit boards using an adhesion layer are described. A substrate with two surfaces is exposed to a bifunctional organic compound to form an adhesion layer on the first substrate surface. A resin layer is then deposited on the adhesion layer and the exposed substrate surfaces. Portions of the resin layer may be removed to expose metal pads for contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.