Patent · US Active

Sintering materials and attachment methods using same

US11389865B2 · kind B2 · utility

0Cited by

5References

23Claims

0Family size

Assignee

ALPHA ASSEMBLY SOLUTIONS INC. · US

Inventors

Shamik Ghoshal · Kanchinakote, IN
V. Sathish Kumar · Kanchinakote, IN
Pavan Vishwanath · Bengaluru, IN
Ranjit Pandher · South Plainfield, US
Remya Chandran · Waterbury, US
Sutapa Mukherjee · South Plainfield, US
Siuli Sarkar · South Plainfield, US
Bawa Singh · Cherry Hill, US
Ravindra M. Bhatkal · East Brunswick Township, US

Key dates

Filing date	Jun 12, 2015
Grant date	Jul 19, 2022
Priority date	—
Expiry date	Jan 3, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1131
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.