Offset head-spindle for chemical mechanical polishing
US11389925B2 · kind B2 · utility
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21References
21Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 20, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jul 17, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional rotation of the carrier head about the axis, which allows for a greater area traversed on the polishing surface, improving chemical mechanical polishing uniformity on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.