Semiconductor device including reinforced corner supports
US11393735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Feb 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed having reinforced supports at corners of the device. The semiconductor device may include solder balls on a lower surface of the device for soldering the device onto a printed circuit board. In one example, the solder balls at the corners of the semiconductor device may be replaced by support billets having more mass and more contact area between the semiconductor device and the PCB. In a further example, screws may be provided at the corners of the device (instead of the corner solder balls or in addition to the corner solder balls). These screws may be placed through the corners of the semiconductor device and into the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.