Patent · US Active

Microelectronic assemblies

US11393777B2 · kind B2 · utility

1Cited by

0References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Adel A. Elsherbini · Chandler, US
Patrick Morrow · Portland, US
Henning Braunisch · Chandler, US
Kimin Jun · Hillsboro, US
Brennen Mueller · Portland, US
Shawna M. Liff · Scottsdale, US
Johanna M. Swan · Scottsdale, US
Paul B. Fischer · Portland, US

Key dates

Filing date	Dec 29, 2017
Grant date	Jul 19, 2022
Priority date	—
Expiry date	Jan 7, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16225
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may a die having a front side and a back side, the die comprising a first material and conductive contacts at the front side; and a thermal layer attached to the back side of the die, the thermal layer comprising a second material and a conductive pathway, wherein the conductive pathway extends from a front side of the thermal layer to a back side of the thermal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.