Semiconductor package devices and method for forming semiconductor package devices

US11393784B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Roland Rupp · Achern, DE
• Alexander Breymesser · Villach, AT
• Andre Brockmeier · Villach, AT
• Carsten von Koblinski · Velden am Wörther See, AT
• Francisco Javier Santos Rodriguez · Villach, AT
• Ronny Kern · Finkenstein, AT

Key dates

• Filing date: Aug 30, 2017
• Grant date: Jul 19, 2022
• Expiry date: Oct 11, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/13091
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for forming semiconductor devices includes attaching a glass structure to a wide band-gap semiconductor wafer having a plurality of semiconductor devices. The method further includes forming at least one pad structure electrically connected to at least one doping region of a semiconductor substrate of the wide band-gap semiconductor wafer, by forming electrically conductive material within at least one opening extending through the glass structure.