Microelectronic device assemblies and packages including surface mount components
US11393794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jul 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, at least one surface mount component operably coupled to conductive traces of at least one dielectric material, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.