Treatment device, plating apparatus including the same, conveying device, and treatment method
US11396714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2017 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Jul 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.