Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus
US11401612B2 · kind B2 · utility
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8References
19Claims
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Key dates
| Filing date | Feb 5, 2018 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jan 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1311
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.