Polygon integrated circuit (IC) packaging
US11410894B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2019 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Oct 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic system includes two integrated circuit (IC) packages that are connected by a package to package (PP) connector. The PP connector may include cabling between a first cabling connector and a second cabling connector. The first cabling connector may be seated to a first carrier connector upon a first IC device carrier of the first IC device package. The second cabling connector may be seated to a second carrier connector upon a second IC device carrier of the second IC device package. The electronic system may further include a heat sink connected to the IC packages, to the first cabling connector, and to the second cabling connector. An IC device may route I/O data through the PP connector, effectively increasing the number of I/O routes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.