Electronic module for high power applications

US11410977B2 · kind B2 · utility

Assignee

• Analog Devices International Unlimited Company · IE

Inventors

• John David Brazzle · Tracy, US
• Frederick E. Beville · San Jose, US
• Yucheng Ying · San Jose, US
• Zafer Kutlu · Menlo Park, US

Key dates

• Filing date: Nov 12, 2019
• Grant date: Aug 9, 2022
• Expiry date: Jul 9, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic module can include a first integrated device package comprising a first substrate and an electronic component mounted to the first substrate. A first vertical interconnect can be mounted to and electrically connected to the first substrate. The first vertical interconnect can extend outwardly from the first substrate. The electronic module can include a second integrated device package comprising a second substrate and a second vertical interconnect having a first end mounted to and electrically connected to the second substrate. The second vertical interconnect can have a second end electrically connected to the first vertical interconnect. The first and second vertical interconnects can be disposed between the first and second substrates.