Film forming apparatus
US11414754B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 19, 2019 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Jul 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming apparatus includes: a stage on which a workpiece on which a film is to be formed is placed; a gas supply part provided so as to face the stage, including a heater provided to be controlled to a predetermined temperature, and configured to supply a carrier gas; and a vaporization part provided between the stage and the gas supply part, and configured to be heated by heat generated from the gas supply part to vaporize a film-formation material supplied in a liquid state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.