Patent · US Active

Assembly for use in semiconductor photolithography and method of manufacturing same

US11415893B2 · kind B2 · utility

0Cited by
8References
20Claims
0Family size

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Inventors

Key dates

Filing dateOct 5, 2018
Grant dateAug 16, 2022
Priority date—
Expiry dateOct 5, 2038

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/70825
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An optical assembly and a method of making an optical assembly in which additive manufacturing techniques are used to form a support structure either directly on an optical element or on a carrier that is subsequently bonded to an optical element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.