Interconnect with nanotube fitting
US11417792B1 · kind B1 · utility
1Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Aug 16, 2022 |
| Priority date | — |
| Expiry date | Mar 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.