Apparatus and method for treating substrate, and nozzle unit
US11424139B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Sep 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate and a nozzle unit having a nozzle that dispenses a chemical onto the substrate, in which the nozzle is connected with a ground line, and a variable resistor is provided on the ground line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.