Hybrid interconnect for laser bonding using nanoporous metal tips
US11424214B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Nov 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.