Electronic device bonding structure and fabrication method thereof
US11424216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Sep 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.