Pedestal heater for spatial multi-wafer processing tool
US11430686B2 · kind B2 · utility
3Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2020 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | Nov 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Substrate supports comprising a top plate positioned on a shaft are described. The top plate including a primary heating element a first depth from the surface of the top plate, a inner zone heating element a second depth from the surface of the top plate and an outer zone heating element a third depth from the surface of the top plate. Substrate support assemblies comprising a plurality of substrate supports and methods of processing a substrate are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.