Microelectronic device with embedded die substrate on interposer
US11430740B2 · kind B2 · utility
1Cited by
27References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Aug 30, 2022 |
| Priority date | — |
| Expiry date | May 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic devices with an embedded die substrate on an interposer are described. For example, a microelectronic device includes a substrate housing an embedded die. At least one surface die is retained above a first outermost surface of the substrate. An interposer is retained proximate a second outermost surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.