Polishing table and polishing apparatus having ihe same
US11433502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2018 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Oct 16, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B45/006
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.