Showerhead device for semiconductor processing system
US11437249B2 · kind B2 · utility
2Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2020 |
| Grant date | Sep 6, 2022 |
| Priority date | — |
| Expiry date | Jul 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3065
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To create constant partial pressures of the by-products and residence time of the gas molecules across the wafer, a dual showerhead reactor can be used. A dual showerhead structure can achieve spatially uniform partial pressures, residence times and temperatures for the etchant and for the by-products, thus leading to uniform etch rates across the wafer. The system can include differential pumping to the reactor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.