Patent · US Active

Coated compressive subpad for chemical mechanical polishing

US11440158B2 · kind B2 · utility

0Cited by

4References

10Claims

0Family size

Assignee

CMC Materials LLC · US

Inventors

Diane Scott · Portland, US
Paul Andre Lefevre · Portland, US

Key dates

Filing date	Jan 19, 2018
Grant date	Sep 13, 2022
Priority date	—
Expiry date	Mar 16, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24D18/0072
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.