Method of controlling substrate processing apparatus, and substrate processing apparatus
US11441224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2020 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | May 8, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/466
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of controlling a substrate processing apparatus that includes a stage, an annular member, a gas introduction mechanism, an exhaust part and a heat transfer gas introduction supply/exhaust part, the method including: mounting a substrate on the stage, and mounting the annular member on the substrate to press the substrate; creating a pressure of a heat transfer gas to be supplied into a space formed between a rear surface of the substrate and a front surface of the stage using the heat transfer gas supply/exhaust part; supplying the heat transfer gas into the space from the heat transfer gas supply/exhaust part; introducing the gas from the gas introduction mechanism into a container; exhausting the heat transfer gas from the space through an orifice; subsequently, exhausting the heat transfer gas from the space; and removing the annular member from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.