Package structure and manufacturing method thereof
US11445617B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2019 |
| Grant date | Sep 13, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure is disclosed herein. The package structure includes an insulating composite layer, a sealant disposed on the insulating composite layer, a first chip embedded in the sealant and having a plurality of first conductive pads exposed through the sealant, a circuit layer module having a plurality of circuit layers and a plurality of dielectric layers having a plurality of conductive vias, a second chip embedded in the circuit layer module and has a plurality of second conductive pads electrically connected to the circuit layers through the conductive vias, and a protecting layer having a plurality of openings disposed on the circuit layer module, in which the openings expose a portion of the circuit layer module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.