Steam treatment stations for chemical mechanical polishing system

US11446711B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Haosheng Wu · San Jose, US
• Jianshe Tang · San Jose, US
• Hari Soundararajan · Sunnyvale, US
• Shou-Sung Chang · Mountain View, US
• Hui Chen · Burlingame, US
• Chih Chung Chou · San Jose, US
• Alexander John Fisher · Santa Clara, US
• Paul D. Butterfield · San Jose, US

Key dates

• Filing date: May 28, 2020
• Grant date: Sep 20, 2022
• Expiry date: Jul 14, 2040

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B08B2230/01
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.