Variable loop control feature
US11449026B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2021 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | May 21, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method includes identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system. The recipe includes iterations of a set of processes. Each iteration is for depositing at least one layer. The method further includes determining iteration adjustments to cause uniformity of the layers. Each iteration adjustment corresponds to a respective iteration. The method further includes determining multipliers to cause an adjustment in thickness of one or more layers of the layers. Each multiplier of the multipliers corresponds to a corresponding iteration. The method further includes storing the iteration adjustments and the multipliers as stored iteration adjustments and stored multipliers. The layers are deposited on substrates based on the recipe and the stored iteration adjustments and the stored multipliers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.