Scalable, high load, low stiffness, and small footprint loading mechanism
US11449111B2 · kind B2 · utility
2Cited by
30References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | May 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/183
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.