Method of bottom-up metallization in a recessed feature
US11450562B2 · kind B2 · utility
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1References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 15, 2020 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Nov 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of metallization includes receiving a substrate having a recess formed therein. The recess has a bottom and sidewalls, and a conformal liner is deposited on the bottom and sidewalls of the recess. The conformal liner is removed from an upper portion of the recess to expose upper sidewalls of the recess while leaving the conformal liner in a lower portion of the recess covering the bottom and lower sidewalls of the recess. Metal is deposited in a lower portion of the recess to form a metallization feature including the conformal liner in the lower portion of the recess and the metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.