Inventor · Albany, NY, US

Nicholas Joy

15Patents

2h-index

37Co-inventors

46Inventor score

Filing activity: Apr 29, 2016 → Nov 28, 2022

Most-cited inventions

Patent	Title	Area	Cited by	Status
US10861744B2	Platform and method of operating for integrated end-to-end CMP-less interconnect process	Emerging Cross-Sectional Technologies	6	Active
US10903077B2	Methods to protect nitride layers during formation of silicon germanium nano-wires in microelectronic workpieces	Electricity	2	Active
US10734278B2	Method of protecting low-K layers	Electricity	2	Active
US10580691B2	Method of integrated circuit fabrication with dual metal power rail	Electricity	1	Active
US9875947B2	Method of surface profile correction using gas cluster ion beam	Electricity	1	Active
US11322364B2	Method of patterning a metal film with improved sidewall roughness	Electricity	1	Active
US11024535B2	Method for filling recessed features in semiconductor devices with a low-resistivity metal	Electricity	1	Active
US11133194B2	Method for selective etching at an interface between materials	Electricity	0	Active
US12417925B2	Method of conductive material deposition	Electricity	0	Active
US10700009B2	Ruthenium metal feature fill for interconnects	Electricity	0	Active
US10256095B2	Method for high throughput using beam scan size and beam position in gas cluster ion beam processing system	Electricity	0	Active
US12334391B2	Method for patterning a substrate using photolithography	Electricity	0	Active
US11450562B2	Method of bottom-up metallization in a recessed feature	Electricity	0	Active
US11621190B2	Method for filling recessed features in semiconductor devices with a low-resistivity metal	Electricity	0	Active
US12057322B2	Methods for etching metal films using plasma processing	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.