Embedded packaging structure having shielding cavity and manufacturing method thereof
US11450619B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2021 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Aug 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embedded package structure having a shielding cavity according to an embodiment of the present disclosure includes a device embedded in an insulating layer, and a shielding cavity enclosing the device, wherein the shielding cavity is defined by a shielding wall embedded in the insulating layer and surrounding the device on four sides, and first and second wiring layers which cover first and second end faces of the shielding wall and are electrically connected with the shielding wall; wherein a signal line leading-out opening is to formed between the first end face of the shielding wall and the first wiring layer, and a signal line connected with a terminal of the device is led, from the signal line leading-out opening, out of the shielding cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.