Wenshi Wang
14Patents
1h-index
16Co-inventors
40Inventor score
Filing activity: May 12, 2020 → Nov 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11255149B1 | Multifunctional directional wireline core drilling device | Fixed Constructions | 1 | Active |
| US11942465B2 | Embedded structure, manufacturing method thereof and substrate | Electricity | 0 | Active |
| US11579362B2 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Physics | 0 | Active |
| US11569177B2 | Support frame structure and manufacturing method thereof | Electricity | 0 | Active |
| US12148676B2 | Embedded chip package and manufacturing method thereof | Electricity | 0 | Active |
| US11854920B2 | Embedded chip package and manufacturing method thereof | Electricity | 0 | Active |
| US11822121B2 | Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof | Physics | 0 | Active |
| US12002734B2 | Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof | Electricity | 0 | Active |
| US12412843B2 | Support frame structure and manufacturing method thereof | Electricity | 0 | Active |
| US11114310B1 | Embedded packaging method capable of realizing heat dissipation | Electricity | 0 | Active |
| US12418988B2 | Inductor-integrating embedded support frame and substrate, and manufacturing method thereof | Electricity | 0 | Active |
| US11450619B2 | Embedded packaging structure having shielding cavity and manufacturing method thereof | Electricity | 0 | Active |
| US12400967B2 | Embedded packaging structure and manufacturing method thereof | Electricity | 0 | Active |
| US11984414B2 | Packaging structure with antenna and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.