Patent · US Active

Magnetic coils in locally thinned silicon bridges and methods of assembling same

US11456116B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andreas Augustin · Munich, DE
Bernd Waidhas · Nittendorf, DE
Sonja Koller · Regensburg, DE
Reinhard Mahnkopf · Oberhaching, DE
Georg Seidemann · Landshut, DE

Key dates

Filing date	Mar 30, 2017
Grant date	Sep 27, 2022
Priority date	—
Expiry date	Mar 24, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/32
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A recess in a die backside surface occupies a footprint that accommodates an inductor coil that is formed in metallization above an active surface of the die. Less semiconductive material is therefore close to the inductor coil. A ferromagnetic material is formed in the recess, or a ferromagnetic material is formed on a dielectric layer above the inductor coil. The recess may extend across a die that allows the die to be deflected at the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.