Substrate support pedestal
US11456161B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2019 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Sep 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The systems and methods discussed herein are associated with substrate support pedestals used in processing chambers to manufacture semiconductors, electronics, optics, and other devices. The substrate support pedestals include an electrostatic chuck body bonded to a cooling base via a bond layer. A gas flow passage is formed between a top surface of the electrostatic chuck body and a bottom surface of the cooling base, and a porous plug is positioned in the gas flow passage. The gas flow passage passes through a hole in the bond layer and the porous plug and has a swept volume physically shielded from an inside edge of the hole in the bond layer, protecting the bond layer from erosion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.