Method of lapping semiconductor wafer and semiconductor wafer
US11456168B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2017 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Feb 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/83
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a method of lapping a semiconductor wafer, which can suppress the formation of a ring-shaped pattern in a nanotopography map. The method of lapping a semiconductor wafer includes: a stopping step of stopping lapping of a semiconductor wafer; a reversing step of reversing surfaces of the semiconductor wafer facing a upper plate and a lower plate after the stopping step; and a resuming step of resuming lapping of the semiconductor wafer after the reversing step while maintaining the reversal of the surfaces facing the plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.