Microelectronic device assemblies and packages and related methods
US11456284B2 · kind B2 · utility
3Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2020 |
| Grant date | Sep 27, 2022 |
| Priority date | — |
| Expiry date | Jul 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.