Method and apparatus for cleaning semiconductor wafer

US11462423B2 · kind B2 · utility

Assignee

• ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

• Hui Wang · Shanghai, CN
• Fuping Chen · Shanghai, CN
• Liangzhi Xie · Shanghai, CN
• Shena Jia · Shanghai, CN
• Xi Wang · Shanghai, CN
• Xiaoyan Zhang · Shanghai, CN

Key dates

• Filing date: Apr 8, 2019
• Grant date: Oct 4, 2022
• Expiry date: Jan 10, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67781
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus for cleaning semiconductor wafer, combining batch cleaning and single wafer cleaning together. The method includes: taking at least two wafers from a cassette in a load port and putting said wafers into a first tank filled with chemical solution; after processing said wafers in the first tank, taking said wafers out of the first tank and keeping said wafers wet; putting said wafers into a second tank filled with liquid; after processing said wafers in the second tank, taking said wafers out of the second tank and keeping said wafers wet; putting one of said wafers on a chuck inside a single wafer cleaning module; rotating the chuck while applying chemical solution on said wafer; applying deionized water on said wafer; drying said wafer; taking said wafer out of the single wafer cleaning module and putting said wafer back to the cassette in the load port.