Discharging method and substrate processing apparatus
US11462431B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Apr 21, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Dec 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A discharging method of removing electric charge from a substrate is provided. In the discharging method, gas is supplied into a processing chamber while the substrate is placed on an electrostatic chuck provided in the processing chamber, and direct-current (DC) voltage is applied to an attracting electrode of the electrostatic chuck, until discharge occurs in the processing chamber. After the discharge occurs, the DC voltage is adjusted to a magnitude in which an amount of charge on the substrate becomes zero or becomes in a neighborhood of zero, and the substrate is removed from the electrostatic chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.