Electronic package including electromagnetic shielding structure and method of manufacture
US11462485B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2021 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Apr 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and electrically connected to the substrate. The conductive elements are disposed on the substrate and electrically connected with the grounding circuit on the substrate. The metal sheet is disposed above the electronic component and is in electrical contact with the conductive elements. The molding layer is formed between the substrate and the metal sheet to enclose the electronic component and the conductive elements. The present disclosure further provides a method of manufacturing the above electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.