Jung-Wei Chen
3Patents
1h-index
6Co-inventors
27Inventor score
Filing activity: Jan 26, 2021 → Mar 23, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11355356B1 | Manufacturing method of semiconductor package comprising heat spreader | Electricity | 1 | Active |
| US11462485B2 | Electronic package including electromagnetic shielding structure and method of manufacture | Electricity | 0 | Active |
| US11462454B2 | Semiconductor package comprising heat spreader and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.