Patent · US Active

Enhanced cathodic ARC source for ARC plasma deposition

US11466360B2 · kind B2 · utility

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20References
13Claims
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Key dates

Filing dateAug 19, 2020
Grant dateOct 11, 2022
Priority date
Expiry dateAug 25, 2040

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C14/243
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An improved cathodic arc source and method of DLC film deposition with a carbon containing directional-jet plasma flow produced inside of cylindrical graphite cavity with depth of the cavity approximately equal to the cathode diameter. The generated carbon plasma expands through the orifice into ambient vacuum resulting in plasma flow strong self-constriction. The method represents a repetitive process that includes two steps: the described above plasma generation/deposition step that alternates with a recovery step. This step provides periodical removal of excessive amount of carbon accumulated on the cavity wall by motion of the cathode rod inside of the cavity in direction of the orifice. The cathode rod protrudes above the orifice, and moves back to the initial cathode tip position. The said steps periodically can be reproduced until the film with target thickness is deposited. Technical advantages include the film hardness, density, and transparency improvement, high reproducibility, long duration operation, and particulate reduction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.