Film-forming apparatus
US11466365B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Apr 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a film-forming apparatus including: a processing container, wherein a reaction gas is supplied into the processing container; a stage disposed inside the processing container and provided with a substrate heating part, the stage being configured to place a substrate thereon; a support member configured to support the stage from a rear surface of the stage, wherein the rear surface faces a placement surface on which the substrate is placed; a temperature control member disposed on the rear surface of the stage and including a hollow portion formed to cover the support member, the temperature control member configured to have a controllable temperature; a heat-insulating member disposed between the stage and the temperature control member; and a purge gas supply part configured to supply a purge gas to a first gap formed between the support member and the temperature control member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.