Contact release method in inspection apparatus and inspection apparatus
US11467208B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2021 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Jun 14, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07342
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for releasing contact between probes and a substrate is provided. In a state where the probes are pressed against the substrate to be in contact with the substrate, a pressure is reduced in an inspection space that is surrounded by a substrate support having thereon the substrate, a tubular member attracting and holding the substrate support through a seal member, and a frame to which a probe card is fixed. The method includes raising an alignment mechanism to a predetermined position to be close to the substrate support, subsequently stopping the pressure reduction of the inspection space and supporting the substrate support by the alignment mechanism located at the predetermined position while preventing release of the contact, subsequently lowering the alignment mechanism supporting the substrate support to release the contact, and subsequently stopping the attracting and holding of the substrate support by the tubular member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.