Heterogeneous integration of components onto compact devices using moire based metrology and vacuum based pick-and-place

US11469131B2 · kind B2 · utility

Assignee

• The Board of Regents of the University of Texas System · US

Inventors

• Sidlgata V. Sreenivasan · Austin, US
• Paras Ajay · Austin, US
• Aseem Sayal · Austin, US
• Mark W. McDermott · Austin, US
• Shrawan Singhal · Austin, US
• Ovadia Abed · Austin, US
• Lawrence R. Dunn · Austin, US
• Vipul Goyal · Austin, US
• Michael Cullinan · Austin, US

Key dates

• Filing date: Dec 22, 2017
• Grant date: Oct 11, 2022
• Expiry date: Jun 12, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/95
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.