Embedded microstrip transmission line
US11469485B2 · kind B2 · utility
2Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2020 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Mar 6, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y10/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can include a superconducting material layer positioned on a raised portion of a dielectric substrate. The raised portion can extend from a surface of the dielectric substrate. The apparatus can also comprise a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.