Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the same
US11474149B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2020 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Feb 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test apparatus includes a test chamber in which a plurality of the semiconductor packages having a plurality of component dies is secured, an operation tester configured to conduct an operation test to the plurality of semiconductor packages to detect whether at least one semiconductor package is an operation fault package having a fault and identify a fault package point at which the operation fault package is located, a fault heat detector configured to detect a fault heat generated from the fault, and a test controller configured to control the operation tester to conduct the operation test to the plurality of semiconductor packages and control the fault heat detector subsequent to the operation test to detect the fault heat generated from the fault of the operation fault package to determine a vertical point of the fault and to determine a fault die having the fault.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.