Chansik Kwon
3Patents
0h-index
7Co-inventors
24Inventor score
Filing activity: May 28, 2020 → Mar 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11676923B2 | Semiconductor packages | Electricity | 0 | Active |
| US12431442B2 | Semiconductor chips having recessed regions | Electricity | 0 | Active |
| US11474149B2 | Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.