Substrate processing method and apparatus
US11482418B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Mar 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31138
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are a substrate processing apparatus and a substrate processing method capable of achieving uniform trimming throughout an entire surface of a substrate. The substrate processing apparatus includes a gas channel including a center gas inlet and an additional gas inlet spaced apart from the center gas inlet, and a shower plate including a plurality of holes connected to the center gas inlet and the additional gas inlet, wherein a gas flow channel is formed having a clearance defined by a lower surface of the gas channel and an upper surface of the shower plate, the lower surface and the upper surface being substantially parallel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.