Electronic package and fabrication method thereof
US11482470B2 · kind B2 · utility
1Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2020 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | May 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.