Thermal management solutions for integrated circuit packages

US11482471B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Cheng Xu · Chandler, US
• Junnan Zhao · Gilbert, US
• Zhimin Wan · Chandler, US
• Ying Wang · Taichung, TW
• Yikang Deng · New York, US
• Chong Zhang · Chandler, US
• Jiwei Sun · 红钢城街道, CN
• Zhenguo Jiang · Chandler, US
• Kyu Oh Lee · Chandler, US

Key dates

• Filing date: Feb 27, 2019
• Grant date: Oct 25, 2022
• Expiry date: Feb 24, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10734
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.